基于空间节约功能复合的晶圆清洗干燥检测集成装置研究

Integrated Device of Wafer Cleaning and Drying Detection Based on Space-saving Function

新一代集成电路工艺要求晶圆越来越薄,其后处理加工的难度增大.通过各单元模块化的结构设计,有效地将晶圆的“清洗—干燥—检测”3种后处理技术集成起来,整体工艺处理流程时间平均缩短了47.5%.通过改进异丙醇雾化法,有效地提高晶圆干燥的效率,相较于传统的干燥方式,每片晶圆有效面积内残留水痕面积减少38.4%,检测正确率达到99.12%,实验结果验证该装置集成方式对于晶圆后处理工艺优化的优越性.

For the new generation of integrated circuit technology,the wafer is required to be thinner and thinner,and the difficulty of post-processing skill is intensified.Through the modular structure design of each unit,the three post-processing technologies of"cleaning-drying-detecting"can be effectively integrated,and the overall processing time is shortened by 47.5%on average.The improved isopropyl alcohol atomization method can effectively improve the efficiency of wafer drying.Compared with the traditional drying method,the residual water mark area in the effective area of each wafer is reduced by 38.4%,and the detection accuracy rate reaches 99.12%.The experimental results verify the superiority of the device integration method for wafer post-processing optimization.