基于光敏玻璃的高深径比微孔制作技术

Fabrication Technology of High Aspect Ratio Microholes Based on Photosensitive Glass

基于FOTURAN②Ⅱ型光敏玻璃基板,研究曝光烧结腐蚀、激光诱导腐蚀和激光诱导烧结腐蚀三种高深径比微孔制作技术,分别从微孔的圆度、侧壁倾角和深径比的角度分析,并与普通玻璃微孔制作进行对比。结果表明,曝光处理光敏玻璃获得的微孔圆度较好,激光诱导可替代曝光烧结实现对光敏玻璃的变性,规避了玻璃的高温蠕变,提高了微孔位置精度。激光诱导腐蚀光敏玻璃获得的微孔深径比达8.9,侧壁倾角达89°。激光诱导腐蚀法适宜于多类玻璃材料,是一种制作高陡直度、高深径比玻璃微孔的新型制造技术,有利于提高玻璃转接板互连密度,促进微系统高密度集成。

Based on FOTURAN②Ⅱ-type photosensitive glass substrate,three high aspect ratio microhole fabrication technologies,such as exposure sintering corrosion,laser induced corrosion,and laser induced sintering corrosion,are studied.A comparison with ordinary glass microhole is also discussed from the roundness,sidewall inclination,aspect ratio of the microholes.It is found that the roundness of the microholes obtained by the exposure treatment of the photosensitive glass is better.The laser induction can replace the exposure sintering to realize the denaturation of the photosensitive glass,avoid the high temperature creep of the glass,and improve the position accuracy of the microholes.The aspect ratio of microholes obtained by laser-induced etching of photosensitive glass reaches 8.9,and the sidewall inclination angle reaches 89°.The laser-induced etching method is a new manufacturing technology for making glass microholes with high steepness and high aspect ratio on many kinds of glass materials.It is beneficial to improve the interconnection density of the glass transition board and further promote the high-density integration of microsystems.