芯片封装用BGA制球自动给料系统的开发

Development of BGA Ball Feeding System for Chip Packaging

针对BGA焊锡球成型过程中存在的生产效率问题,提出一种芯片封装用BGA焊锡球制球自动给料的系统和方法,以解决焊锡球制球焊料添加过程中需要拆装密闭坩埚的问题,实现持续自动供料,提高生产效率,降低生产成本和人工工作量,提高产品质量,弥补现有技术的不足。

In view of the production efficiency problems existing in the forming process of BGA Solder ball,an automatic feeding system and method of BGA solder ball for chip packaging are proposed to solve the problem of disassembly and assembly of closed crucible in the process of adding solder ball,realize continuous automatic feeding,improve production efficiency,reduce production cost and labor workload,improve product quality and make up for the shortcomings of existing technology.