超薄电子玻璃化学钢化翘曲问题及其解决办法

The Solutions to Warpage of Ultra-thin Electronic Glass after Chemical Tempered

为了提高超薄电子玻璃的强度和抗划伤性能,需要对其进行化学钢化处理,而化学钢化时产生的翘曲问题,一直困扰行业发展。首先通过分析化学钢化翘曲产生机理,找出渗锡量与化学钢化翘曲之间的关系,进而探索解决翘曲的思路和方法。通过大量试验数据对比分析,推理出化学钢化翘曲值与渗锡量之间存在正向线性关系。经过论证,从降低玻璃下表面渗锡量入手,探讨采用加强锡槽密封以及在满足工艺要求前提下适当降低玻璃液锡槽流道温度和成形温度等方式,达到降低超薄电子玻璃下表面渗锡量和化学钢化翘曲值的目标,从而解决化学钢化翘曲问题。

In order to improve the strength and scratch resistance of ultra-thin electronic glass,it needs to be chemically toughened.The warpage problem caused by chemical toughening has been perplexing the development of the industry.Firstly,this paper analyzes the mechanism of chemical tempering warpage,finds out the relationship between tin infiltration and chemical tempering warpage,and then explores the ideas and methods to solve warpage.Then,through the comparative analysis of a large number of test data,it is inferred that there is a positive linear relationship between the warpage value of chemical tempering and the amount of tin infiltration.After demonstration,starting with reducing the tin infiltration on the lower surface of the glass,this paper discusses how to strengthen the sealing of the tin bath and appropriately reduce the channel temperature and forming temperature of the liquid glass tin bath on the premise of meeting the process requirements,so as to achieve the goal of reducing the tin infiltration on the lower surface of the ultra-thin electronic glass and the warpage value of chemical tempering,so as to solve the problem of chemical tempering warpage.