半导体制造业自动化系统设计与实现

Design and Implementation of EAP System in Semiconductor Manufacturing Industry

针对半导体制造业工艺复杂、工序繁多、生产管理困难等问题,笔者设计了一个生产自动化系统(Equipment Automation Program,EAP)。该系统集成了半导体制造设备通信协议,通过物联网技术将机台纳入系统管理并实现智能控制,原本由操作员进行的作业信息校验、机台参数设置、配方设置、配方加载、机台启动以及产品过账等烦琐且易出错的工作由EAP系统自动完成。同时作为连接设备的底层系统为整个工厂的其他上游系统提供机台、产品等信息接口,为企业的数字化、智能化升级提供底层支撑。经过在多个工厂实施,通过EAP系统作业明显降低了操作员技能要求,减少了人力和操作事故,提升了设备使用率和产品良率,加强了半导体制造业对加工全过程的监控和管理。

Aiming at the problems of complex semiconductor manufacturing process,numerous procedures,and difficult production management,the author designed a production automation system(Equipment Automation Program,EAP).The system integrates the communication protocol of semiconductor manufacturing equipment,and integrates the machine into system management and realizes intelligent control through the Internet of Things technology.The operation information verification,machine parameter setting,recipe setting,recipe loading,and machine startup originally performed by the operator And tedious and errorprone tasks such as product posting are automated by the EAP system.At the same time,as the underlying system for connecting equipment,it provides information interfaces such as machines and products for other upstream systems in the entire factory,and provides underlying support for the digital and intelligent upgrade of enterprises.After being implemented in multiple factories,the EAP system operation has significantly reduced operator skill requirements,reduced manpower and operational accidents,improved equipment utilization and product yield,and strengthened the monitoring and management of the entire processing process in the semiconductor manufacturing industry.