摘要
在现代雷达系统中,相控阵雷达以其得天独厚的优势依然占据着强势的地位,其中作为核心器件的收发组件发挥重要的作用。伴随着组件高集成、小型化和轻量化的需求,系统级封装(SiP)的技术得以迅猛的发展。本文设计完成了一种基于陶瓷球栅阵列(CBGA)封装的集成S波段和P波段的四通道变频SiP模块,共集成4路S波段变频和1路P波段双向放大芯片,可切换4种工作模式。四通道的带内发射高、低增益值约为30 dB和14 dB,带内接收高、低增益值约为48 dB和35 dB,满足设计要求。此外,变频SiP通过CBGA方式组装在印刷电路板(PCB)上,器件通过100次-55~125℃的温度循环试验,板级可靠性较高。
In modern radar system,the phased array radar still occupies a strong position with its unique advantages.The transmit/receive module as the core component plays an important role.With the requirement of high integration,miniaturization and lightweight of components,the technology of system in package(SiP)is developing rapidly.In this paper,a four-channel mixer SiP module integrating S-band and P-band is designed based on ceramic ball grid array(CBGA)package,which integrates four S-band frequency conversion chips and one P-band bidirectional amplifier chip,and can switch over four working modes.The high and low transmit gain values of the four channels are about 30 dB and 14 dB,the high and low receive gain values of the four channels are about 48 dB and 35 dB,which meets the design requirement.The mixer SiP was assembled on the printed circuit board(PCB)with CBGA method and passed 100 cycles in-55~125℃temperature cycle test.The high board-level reliability was verified.
作者
刘晓政
邱宇
刘明
闵志先
LIU Xiaozheng;QIU Yu;LIU Ming;MIN Zhixian(The 38th Research Institute of China Electronics Technology Group Corporation,Hefei 230088,China)
出处
《雷达科学与技术》
北大核心
2022年第2期202-208,共7页
Radar Science and Technology
关键词
陶瓷球栅阵列
系统级封装
变频器
增益
可靠性
ceramic ball grid array(CBGA)
system in package
mixer
gain
reliability