一种基于SIP技术的多通道L波段T/R组件设计

A Design of Multichannel L-Band T/R Module Based on SIP Technology

为了满足工程设计需求,提出一种基于系统级封装(System in Package,SIP)技术的多通道L波段收发组件设计方案,详细阐述其实现原理。SIP作为一种先进的系统集成与封装技术,是实现有源相控阵雷达收发(T/R)组件小型化、高密度化及高可靠性的重要途径。针对T/R组件关键技术指标进行设计分析,采用SIP技术进行了关键电路小型化设计,同时进行了多层微波电路PCB设计、T/R模块结构设计等工作,研制了L波段多通道T/R组件实物。收发组件的测试数据验证了设计方案的可行性和工程实用性。

In order to meet the engineering design requirements, a design scheme of multichannel L-band T/R module based on System in Package(SIP) technology is proposed, and its implementation principle is described in detail. SIP technology as a advanced technology for system integration and packaging technology, is a important way to realize the miniaturization, high integration level and reliability of AESA T/R modules. The principle simulation and analysis of T/R module key indicators are carried out, and the miniaturization of key circuit is designed based on the SIP technology. Meanwhile, the integrated PCB design, structure design of T/R module are studied, and the sample is developed. The test results of the T/R module demonstrates the feasibility of the design and satisfy the demand of practical engineering application.