热压键合工艺参数对微流控芯片微通道尺寸变形的影响

Influence of Hot-Pressing Bonding Process Parameters on Dimensional Deformation of Micro-Channel in Microfluidic Chip

为减小环烯烃共聚物(COC)芯片热压键合过程中微通道的变形量,采用单因素实验研究了热键合参数对COC芯片微通道变形的影响规律,为键合参数的设置提供一定的理论指导。研究结果表明,键合参数对芯片微通道的变形有较大影响,键合温度的影响最大,对应的变形量最大极差为20.76,键合压力次之,键合时间的影响最小,对应的最小极差为5.04μm,且与连续相相比,键合参数对COC芯片微通道离散相尺寸变形影响更为显著;在热键合过程中,温度和压力过高会使芯片微通道产生永久变形甚至毁坏芯片微结构,为减小变形,可适当地降低键合温度和压力,延长键合时间来弥补键合不完全的问题。

In order to reduce the deformation of micro-channel in hot-pressing bonding process of cycloolefin copolymer(COC)chips,the influence of thermal bonding parameters on micro-channel deformation of COC chips was studied by single factor experiment,which provided some theoretical guidance for setting bonding parameters.The results show that the bonding parameters have a great influence on the deformation of chip microchannels,and the bonding temperature has the greatest influence,with the maximum range of deformation being 20.76μm,followed by the bonding pressure and the minimum range of bonding time being 5.04μm.Compared with the continuous phase,the bonding parameters have a more significant influence on the size deformation of discrete phase of COC chip microchannels.In the process of thermal bonding,too high temperature and pressure will cause permanent deformation and even destroy the micro-structure of chips.To reduce the deformation,the bonding temperature and pressure can be appropriately reduced and the bonding time can be increased to compensate for the incomplete bonding problem.