建筑装饰用铜合金表面Ni-P化学镀层的制备与性能研究

Study on Preparation and Properties of Ni-P Electroless Coating on Surface of Copper Alloy for Architectural Decoration

为了增加建筑装饰用铜合金的耐磨性,研究了硬质相TiN浓度和热处理对铜合金表面化学镀Ni-P层显微形貌、物相组成、硬度和耐磨性能的影响。结果表明:装饰用铜合金基体主要由CuZn相和CuZn_(5)相组成,化学镀层表面可见Ni的非晶馒头峰和CuZn衍射峰。化学镀层的显微硬度均高于铜合金基体,且化学镀层的硬度会随着TiN浓度增加而增大,在TiN浓度为3~11 g/L时,化学镀层的磨损率小于铜合金基体,且TiN浓度为7 g/L时化学镀层的磨损率最小[1.15×10^(-8) g/(r·N)],此时磨损机制为氧化磨损。Cu-P-TiN化学镀层在300~600℃热处理后发生了晶化转变并形成Ni和Ni_(3)P相;随着热处理温度升高,化学镀层的显微硬度先增加后减小、磨损率先减小后增大,在热处理温度为400℃时获得硬度最大值和磨损率最小值,表明热处理有助于提升化学镀层的耐磨性能。

In order to increase the wear resistance of copper alloy for architectural decoration,the effects of hard phase TiN concentration and heat treatment on the microstructure,phase composition,hardness and wear resistance of Ni-P electroless coating on copper alloy were studied.Results showed that the decorative copper alloy substrate was mainly composed of CuZn phase and CuZn_(5) phase,and the amorphous steamed bread peak of Ni and diffraction peak of CuZn could be seen on the surface of electroless coating.The microhardness of the electroless coating was higher than that of copper alloy substrate,and the microhardness of the electroless coating increased with the increase of TiN concentration.When the concentration of TiN was 3~11 g/L,the wear rate of the electroless coating was lower than that of the copper alloy substrate,the wear rate of the electroless coating was the lowest[1.15×10^(-8) g/(r·N)]when the TiN concentration was 7 g/L,and the wear mechanism was oxidation wear.After the heat treatment at 300~600℃,the electroless Cu-P-TiN coating was crystallized and formed Ni and Ni_(3)P phases.With the increase of heat treatment temperature,the microhardness of the electroless coating first increased and then decreased,and the wear rate first decreased and then increased.When the heat treatment temperature was 400℃,the maximum hardness and minimum wear rate were obtained,indicated that the heat treatment would be helpful to improve the wear resistance of the electroless coating.