航天激光源热设计

Thermal design of laser source for aerospace

为满足航天应用的激光源被动散热要求,提出激光源内部大功耗器件散热解决方案,设计了经由器件、印制电路板到金属结构的导热通道,将热量由器件高效传输至激光源的金属结构,确保器件温度在正常工作范围内;对激光源结构的设计和材料进行优化,增加并优化散热通道,进一步提升散热效率。仿真结果表明:在高温工况下,散热优化后的方案中芯片和激光器最高温度分别降低约100℃和1℃,优化方案有效、可行。

In order to meet the requirements of passive heat dissipation of laser source in aerospace applications,project of heat dissipation solution of high power devices in laser source is proposed.The heat conduction channel from device and printed circuit board to metal structure is designed,which can transfer heat from devices to metal structure efficiently,ensure that the device temperature is within the normal operating range.Efficiency of heat dissipation can be promoted by ways of evolving structure and material of laser soucrce,and by ways of adding or evolving dissipation passages.Simulation results show that,when working in high temperature circumstance,In the heat dissipation optimized scheme,the maximum temperature of chip and laser is reduced by about 100℃and 1℃respectively,the optimized project is effective and viable.