基于MEMS的微热板结构设计与性能测试研究

Structure Design and Performance Test of Micro Hot Plate Based on MEMS

微热板作为气敏半导体传感器的关键组成部分,为敏感材料提供稳定的加热温度。为降低微热板功耗,提升热稳定性,设计了一种悬浮式结构微热板,通过仿真对微热板材料组成、膜层厚度等关键参数进行优化。基于MEMS工艺进行了流片,测试得到微热板的功耗为24 mW,热响应时间为9.6 ms,一致性、稳定性较好;通过拟合微热板的温阻特性,证明温度和电阻具有良好的线性关系。

As a key component of gas sensitive semiconductor sensor,micro hot plate provides stable heating temperature for sensitive materials.In order to reduce the power consumption and improve the thermal stability of the micro hot plate,a suspended micro hot plate was designed.The key parameters such as material composition and film thickness of the micro hot plate were optimized by simulation.Based on MEMS process,the film was taped out.The test shows that the power consumption of the micro hot plate is 24 mW,the thermal response time is 9.6 ms,and the consistency and stability are good.By fitting the thermal resistance characteristics of the micro hot plate,it is proved that there is a good linear relationship between temperature and resistance.