含氰基及烯丙基的新型苯并恶嗪树脂研究

Study on novel benzoxazine resin containing cyano and allyl groups

采用二烯丙基双酚A、氨基苯甲腈和多聚甲醛为原料通过无溶剂法合成一种二烯丙基双酚A型苯并恶嗪单体(DBA-an),将氰基与烯丙基引入到苯并恶嗪单体中。DBA-an单体的结构经核磁共振波谱与红外光谱表征确认,并采用示差扫描量热分析和原位红外光谱研究了DBA-an的聚合行为,还通过热重分析对其固化产物聚苯并恶嗪的热稳定性进行了研究。结果表明,制备的DBA-an具有较宽的加工窗口,固化得到的聚苯并恶嗪具有优异的热稳定性,其T_(d5)、T_(d10)分别为376℃和417℃。800℃下的残炭率为36.7%。该树脂有望作为基体树脂用于航空航天和微电子工业等领域,具有很好的发展前景。

A diallyl bisphenol A benzoxazine monomer(DBA-an) was synthesized by a solvent-free method using diallyl bisphenol A,aminobenzonitrile and paraformaldehyde. The cyano and allyl groups were introduced into benzoxazine monomers. The structure of DBAan monomer was confirmed by nuclear magnetic resonance spectroscopy and infrared spectroscopy, and the polymerization behavior of DBA-an was studied by differential scanning calorimetry analysis and in situ infrared spectroscopy.The thermal stability of the cured product polybenzoxazine was evaluzated by TGA. The results showed that the prepared DBA-an had a wide processing window, and the cured polybenzoxazine had excellent thermal stability, and its T;and T;were 376 ℃ and 417 ℃, respectively. The char yield at 800 ℃was 36.7%. The resin is expected to be used as a matrix resin in the fields of aerospace and microelectronics industry, and has a good development prospect.