双酚芴环氧树脂体系热性能和粘接性能研究

Study on Thermal Properties and Adhesive Properties of Bisphenol Fluorene Epoxy Resin Systems

环氧树脂是一种性能优异的热固性树脂,在结构胶粘剂和纤维增强复合材料领域应用广泛。但是常见的环氧树脂体系耐热性普遍较差,近年来,航空航天领域对材料的热性能提出了更高的要求,常规的环氧树脂体系已经无法满足耐高温需求。针对该问题,我们设计了一种耐热性较高的双酚芴型环氧树脂体系,并对其热性能和粘接性能进行了研究。在本文中,首先采用流变学方法和DSC研究了其工艺性能,使用DMA和TGA法分析了环氧树脂体系的耐热性能,并通过单搭接剪切试验测试了该环氧体系的粘接性能。结果表明,双酚芴型环氧树脂体系可在180℃固化,固化后的玻璃化转变温度达到190℃,失重5%时的温度为392℃,150℃时的剪切强度为5.8 MPa,展现了优异的耐热性能和粘接性能。

Epoxy resin is a thermosetting resin with excellent properties,which is widely used in the fields of structural adhesives and fiber-rein-forced composite materials.However,the heat resistance of common epoxy resin systems is generally poor.In recent years,with the improvement of the heat resistance requirements of materials in the aerospace field,conventional epoxy resin systems have been unable to meet the requirements.Hence,a bisphenol fluorene epoxy resin system with high heat resistance is designed,its thermal properties and adhesive properties are studied.The process properties of the epoxy resin system are firstly investigated by rheological methods and DSC methods,and the heat resistance properties of epoxy resin systems are analyzed by DMA and TGA methods.Then the adhesive properties of the epoxy system are tested by single lap shear test.The results show that the bisphenol fluorene epoxy resin system can be cured at 180℃,exhibiting a high the glass transition temperature of 190°C after curing,and a temperature at 5% weight loss of 392°C.In addition,it presents a shear strength of 5.8MPa at 150°C,demonstrating excellent heat resistance and adhesive properties.