大尺寸一体化外壳结构可靠性研究

Study on Reliability of Large-size Integrated Package

基于高密度多层Al_(2)O_(3)陶瓷技术体系,通过开展零件结构可靠性设计,解决了复杂结构外壳的可靠性难题,研制出一款适用于数字微波集成一体化封装的大尺寸、高可靠外壳。该外壳热沉底盘平面度<50μm,满足应用及可靠性要求。通过本文研究,具备了大尺寸复杂结构外壳设计技术,为后续的新产品设计提供参考。

Based on the high-density multilayer Al_(2)O_(3) ceramic technology system,through structural reliability design of parts,the reliability problems of complex structure package is solved,and large size and high reliability package suitable for digital-analog mixed package is developed.The flatness of the heat sink is<50μm,whichmeets the requirements of application and reliability.Through this study,the design technology of large-size complex structure package is developed,which can provide references for subsequent new product design.