基于后端流程的层次化物理设计方法的研究

Research on Hierarchical Physical Design Method Based on Backend Process

本文通过使用物理设计工具Innovus对一款ARM的mpcore芯片分别进行展平式物理设计和层次化物理设计,对层次化物理设计方法进行了研究和分析。并使用了基于模拟模型(flex model)的层次化物理设计对流程进行优化。完成了芯片的物理设计的各个阶段并实现最终的时序收敛。通过对两种物理设计方法的设计总耗时的比较,说明了层次化物理设计在缩短设计周期上有明显优势。

By using the physical design tool Innovus to implement an ARM mpcore design with the flatten physical design flow and the hierarchical physical design flow respectively,the paper studies and analyzes the hierarchical physical design method.It also uses the hierarchical physical design method based on the flex model to optimize the process.Completed all stages,achieving final top-level timing closure.The comparison of the total design time of the two physical design methods shows that the hierarchical physical design has the obvious advantage in shortening the design cycle.