摘要
介绍了一种在微波多芯片模块中,芯片微波端口键合丝较长的情况下,如何对其进行频率拓宽的方法。针对芯片微波端口键合丝引入的失配情况进行了分析和准确的模型提取,并以此得出了一个有效的匹配电路结构(T形结)。在键合丝长度相同的情况下,此T形匹配方式将成倍提高其使用频率,改善电路性能。同时,此T形匹配结构简单,便于设计和应用。
This paper introduces a method of how to broaden the frequency of microwave multi chip module when the bonding wire of Chip microwave port is long.Aiming at the mismatch situation of introducing the chip microwave port bonding wire,it is analyzed and the accurate model is extracted.According to this,an effective matching circuit structure(T-junction)is obtained.When the length of bonding wire is the same,this T-shaped matching method will multiply its use frequency and improve the circuit performance.At the same time,the T-shaped matching structure is simple and convenient for design and application.
作者
罗建
LUO Jian(The 13th Research Institute of China Electronics Technology Corporation,Shijiazhuang 050051,China)
出处
《现代信息科技》
2022年第2期78-80,共3页
Modern Information Technology
关键词
T形结
键合丝
芯片
T-junction
bonding wire
chip