硅铝合金电镀金工艺

Electroless gold plating process of silicon-aluminum alloy

介绍了一种硅铝合金电镀金工艺,其前处理主要包括喷砂、除油、碱蚀、酸蚀、二次沉锌及化学镀镍。通过喷砂去除硅铝合金表面的缺陷来增强硅铝合金基体与电镀层的咬合力,以酸蚀除去硅铝合金表面的硅、铁、铜等杂质,可在硅铝合金表面获得结合力强、可焊性好的电镀金层。

A process for electroplating gold on silicon-aluminum alloy was introduced,mainly including sandblasting,degreasing,alkaline etching,acid etching,two-stage zinc immersion,and electroless nickel plating.The defects on the surface of silicon-aluminum alloy are removed by sandblasting to enhance the interlock between gold coating and silicon-aluminum alloy substrate,and the silicon,iron,copper,and other impurities on the surface of silicon-aluminum alloy were removed by acid etching.A gold coating with good adhesion and weldability could be prepared thereafter.