一种晶圆高温监测技术

A High Temperature Monitoring Technology for Wafers

随着国内半导体和集成电路产业的蓬勃发展,晶圆作为这类行业的核心组成部分,其品质直接影响了行业的健康发展。而温度作为基础参数,其精确监测和控制都至关重要。在晶圆的生产及加工工艺中,温度轻微的非期望偏差都会严重破坏晶圆性能一致性,导致良率下降。本文综合分析了几种晶圆测温方式,主要围绕如何排除热电偶测温结点易脱落以及引线对晶圆表面的污染和损伤等难点,提出一种热电偶嵌入式晶圆测温片的改进设计,对国内相关产品的研发具有一定的借鉴意义。

With the vigorous development of the domestic semiconductor and integrated circuit industries, wafers are the core components of such industries, and their quality directly affects the healthy development of the industry.As the basic parameter, the precise monitoring and control of temperature are crucial.In the production and processing of wafers, slight undesired deviations in temperature can seriously disrupt the uniformity of wafer performance, resulting in decreased yield.This paper comprehensively analyzes several wafer temperature measurement methods, mainly focusing on how to eliminate the difficulties such as the easy falling off of the thermocouple temperature measurement junction and the contamination and damage of the lead wire to the wafer surface.An improved design of thermocouple embedded wafer temperature measuring sheet is proposed, which has certain reference significance for the research and development of related domestic products.