现代电子装联工艺技术的发展走向

Development Trend of Modern Electronic Assembly Technology

现代芯片的封装工艺技术发展正方兴未艾,发展的同时迅速地带动着作为现代电子产品装联的主导SMT进入了后SMT(post-SMT)的时期。超高性能、超微型化、超薄型化的新产品设计科技的异军突出,使原有的产品设计流程和定义逐渐力不从心。本文根据现代电子装联工艺发展态势,比较全面地说明了现代电子产品装联工艺技术以及设备的分类,详细阐明了现代电子装联工艺技术发展的重要性以及未来趋势。

The development of packaging technology of modern chips is just in the ascendant,and at the same time,it has rapidly driven SMT,which is the leading assembly line of modern electronic products,into the post-SMT(post-SMT)era.The emergence of new product design technologies of ultra-high performance,ultra-miniaturization and ultra-thin design has made the original product design process and definition gradually inadequate.According to the development trend of modern electronic assembly technology,this article comprehensively explains the classification of modern electronic product assembly technology and equipment,and elaborates the importance and future trend of modern electronic assembly technology development.