机载电子设备元器件焊点热疲劳寿命研究

RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT

针对机载电子设备元器件焊点热疲劳失效问题,研究了适合工程应用的元器件焊点热疲劳寿命评估方法,提出了基于应变能的经验公式适合印制板组件级多元器件热疲劳寿命的评估。探讨了元器件焊点热疲劳寿命的加速试验方法,通过加速试验案例证明试验可行,仿真计算可信。研究结果表明,元器件焊点热疲劳寿命仿真和加速试验方法适合工程应用。

Aiming at the problem of thermal fatigue of solder joints for airborne electronic equipment, the evaluation method of thermal fatigue life of solder joints suitable for engineering application was studied, considered that the empirical equation based on strain energy was suitable for multiple components on PCBA. The accelerated test method of thermal fatigue life of solder joints was discussed, the accelerated test case proved that the test was feasible, and the simulation was credible. The results indicated that the simulation and accelerated test method of thermal fatigue life of solder joints were suitable for engineering application.