环氧树脂胶膜配方开发与粘接性能

Formulation development and bonding performance of epoxy resin film

本文采用甲苯二异氰酸酯(TDI)对酚醛型环氧树脂(EPN)进行化学改性,在树脂基体中引入柔性的恶唑烷酮环结构。探究咪唑固化剂(MZ)、玄武岩纤维(BF)、聚醚砜(PES)和铝粉对胶膜粘接性能的影响。通过傅里叶红外光谱和核磁共振光谱表征恶唑烷酮环的合成,扫描电子显微镜(SEM)研究增韧机理,热重(TGA)研究胶膜的固化过程与热稳定性。搭接剪切与滚筒剥离测试表明,增韧剂提升了胶膜的粘接性能,剪切强度与平均滚筒剥离强度可达25.675 MPa和47(N·mm)/mm,同时胶膜拥有优异的热稳定性,在空气与氮气下的T_(5)温度分别达到了337.18℃和364.95℃。

Toluene diisocyanate(TDI)was used to chemically modify the phenolic epoxy resin(EPN),and a flexible oxazolidinone ring structure was introduced into the resin matrix.The effects of imidazole curing agent(MZ),basalt fiber(BF),polyethersulfone(PES),and aluminum powder on the adhesive properties of the film were explored.The synthesis of the oxazolidinone ring was characterized by Fourier infrared spectroscopy and nuclear magnetic resonance spectroscopy,the toughening mechanism was studied by scanning electron microscopy(SEM),and the curing process of the film and its thermal stability was studied by thermogravimetry(TGA).The lap shear and drum peeling tests proved that the toughening agent improved the adhesive performance of the film.The shear strength and average drum peel strength reached 25.675 MPa and 47(N·mm)/mm,and the film had excellent heat stability,the T_(5)temperature under air and nitrogen reached 337.18℃and 364.95℃.