无氧铜电子束焊接试验与分析

Electron Beam Welding Test and Analysis of Oxygen-free Copper

为了研究电流对无氧铜电子束焊接接头金相组织与性能的影响,采用30 mm厚的无氧铜板作为研究对象,选取不同电流进行电子束焊接试验,并对母材和焊接接头的显微组织进行了对比分析。结果表明:随着焊接电流的增大,焊缝宽度增加幅度不大,焊缝厚度增加明显,显微组织为铸态等轴晶粒,140 mA电流条件下焊缝柱状晶细化,接头塑性、韧性明显增强。

In order to study the effect of current on the metallographic structure and properties of oxygen-free copper welded joint, 30 mm thick oxygen-free copper plate was used as the research object, different currents were selected to conduct electron beam welding test, and comparative analysis was carried out on the microstructure of base metal and welded joint. The results show that with the increase of welding current, the weld width increases slightly, the weld thickness increases obviously, and the microstructure is cast equiaxed grain. The weld columnar grain is refined under 140 mA current, and the joint plasticity and toughness are enhanced obviously.