耐电晕聚酰亚胺复合薄膜的新工艺设计

New Method to Prepare Corona Resistant Polyimide Composite Film

由于拥有优异的综合性能,聚酰亚胺复合材料已经成为微电子领域和电子工业不可缺少的基体材料。目前制备聚酰亚胺薄膜的方法包括流延法、浸渍提拉法、离子交换法以及层铺流延法。本文结合工作实际,总结了现有的生产耐电晕聚酰亚胺薄膜的制备工艺,对比了现有工艺的优缺点,并在现有工艺的基础上,提出了多次滚涂生产聚酰亚胺薄膜的新工艺方法。

Polyimide composite materials have gained considerable importance as high-performance polymers and matrices. These materials are used in microelectronic and electrical industries because of their excellent heat resistance, good chemical stability, and low thermal expansion. Polyimide films are mainly prepared by the flow casting method. Polyimide films are produced via dip coating method, and ion exchange method based on the surface of the polyimide can be etched and modified. The advantages and disadvantages of the existing production process of polyimide film were summarized. A new type of corona resistant polyimide composite film with a certain thickness of pure polyimide layer in the middle and a certain thickness of polyimide/alumina hybrid layer on the upper and lower surfaces is proposed aiming at the preparation of high-performance corona resistant polyimide composite film.