印制电路板沉铜制程低钯消耗量工艺研究

The research on low palladium consumption process in PCB electroless copper process

文章对印制板沉铜制程贵金属钯活化剂的消耗进行分类,研究溶胀、中和、除油、活化、加速各工序对钯吸附量的影响因素,总结出降低钯金属消耗的措施和方向,以期在保证沉铜品质情况下最大程度的节约钯金属资源。

This paper classifies the consumption of the precious metal palladium activator in the PCB electroless copper plating process,studies the influence of the processes of swelling,neutralization,clean,activation and acceleration on the amount of palladium adsorbed,and summarizes the measures and directions for reducing palladium metal consumption,in order to save palladium metal resources to the greatest extent while ensuring the quality of electroless copper plating.