一种含凸台铜基印制板制作技术

A manufacturing technology of printed board with bump on copper base

为了提高金属基印制板的散热性,采用金属基上有凸台导热的设计,这类印制板的加工有其特殊性。本文介绍这种含凸台的铜基印制板的制造技术,重点是铜凸台的蚀刻和半固化片开槽控制,最终产品符合客户要求。

In order to improve the heat dissipation of metal based printed boards,the design of heat conduction with bumps on the metal base is adopted.The processing of this kind of printed boards has its particularity.This paper introduces the manufacturing technology of copper based printed board with bump,focusing on the etching of copper bump and the slotting control of semi cured film.The final product meets the requirements of customers.