回焊炉炉温曲线最优控制建模及工艺参数分析

Optimal Control Modeling and Process Parameter Analysis of Reflow Furnace Temperature Curve

回流焊炉温曲线记录了印刷电路板元件焊接过程的温度变化,是焊接质量的主要影响因素。为提高焊接质量,对各温区的温度及传送带的速度进行分析,建立一维的热传导模型,采用差分及最小二乘法,得到电路板中心区域的温度变化情况;进一步设立合理的指标,设计优化模型及搜索算法寻找全局最优。最终得到满足约束条件下的各温区对应的最优温度及最优传送带过炉速度。

The temperature curve of reflow furnace records the temperature change during the welding process of the original printed circuit board components,which is the main factor affecting the welding quality.In order to improve the welding quality,the temperature in each temperature zone and the speed of the conveyor belt were analyzed,and a one-dimensional heat conduction model was established.The temperature change in the central area of the circuit board was obtained by using the difference and least square method;Reasonable indicators were set up,and optimization models and search algorithms were designed to find the global optimum.Finally,the optimal temperature corresponding to each temperature zone and the optimal speed of the conveyor belt passing through the furnace under the constraint conditions were obtained.