Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink

With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment.In this study,thermal resistance theoretical model of the micro-channel heat sink was first established.Then,fabrication process of the micro-channel heat sink was introduced.Subsequently,heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform.Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application.Moreover,the micro-channel structures in the heat sink were optimized by orthogonal test.Based on the orthogonal optimization,heat dissipation performance of the micro-channel radiator was further improved.