热管理用金刚石/Cu复合材料的研究进展

Research progress of diamond/Cu composites for thermal management

金刚石/Cu复合材料具有高导热、低热膨胀系数、密度低等优点,与新一代芯片、电子系统具有良好的匹配性,在热管理材料行业具有良好的应用前景,但是其金刚石与Cu的表面润湿性较差,复合材料的一些热学性能甚至低于单相材料的热学性能。对目前金刚石/Cu复合材料的制备手段、改性方法进行总结,并对仍存在的问题提出了解决方向,希望对相关研究人员提供研究方向上的帮助。

Diamond/Cu composites have the advantages of high thermal conductivity, low coefficient of thermal expansion and low density, etc. They have a good match with the new generation of chips and electronic systems. They have a good application prospect in the thermal management material industry. However, the surface wettability of diamond and Cu is poor, and some thermal properties of the composites are even lower than those of single-phase materials. This paper summarizes the preparation methods and modification methods of diamond/Cu composites, and puts forward the solution direction for the existing problems. It is hoped to promote the further development of diamond/Cu composites.