集成电路制造在线光学测量检测技术:现状、挑战与发展趋势

Inline Optical Measurement and Inspection for IC Manufacturing:State-of-the-Art,Challenges,and Perspectives

在线测量检测技术与装备是保证集成电路(IC)制造质量和良率的唯一有效技术手段,在IC制造过程中必须对IC纳米结构的关键尺寸、套刻误差,以及缺陷等进行快速、非破坏、精确测量与检测。本文首先从尺寸测量和缺陷检测两个方面介绍了IC制造在线光学测量检测技术的研究现状。在此基础上,进一步分析了先进技术节点中所面临的一些新的纳米测量挑战,如更小的特征尺寸、更复杂的三维结构。最后,展望了IC制造在线光学测量检测技术的未来发展趋势。

Inline measurement and inspection technologies and equipments are the only effective means to ensure manufacturing quality and yield of integrated circuits(IC).It is of great significance to realize fast,nondestructive,and precise measurement and inspection of critical dimension(CD),overlay,defects,and so on,during IC manufacturing.In this paper,we first review the current status of optical measurement and inspection techniques for dimensional metrology and defect inspection in IC manufacturing,including CD and overlay measurement,unpatterned and patterned wafer defect inspection,as well as mask defect inspection.Then,we introduce the potential measurement and inspection challenges in advanced technology nodes,for example,smaller feature sizes and more complex three-dimensional architectures.Finally,we present the perspectives of optical measurement and inspection for future IC manufacturing,including hybrid metrology,ultra-short wavelength metrology,high-and super-resolution imaging,as well as advanced data analytics.