焊膏喷印工艺在航空电子组装中的工艺优化研究

The Study of Solder Paste Jet Printing Technology in Avionics Product Assembly Processes

焊膏喷印技术是一种不需要钢网工装,直接将焊料按照设定的形状和厚度喷到印制板对应焊盘上的工艺方法。焊膏喷印的位置及喷印量可灵活编程控制,适用于多品种、小批量的研发生产。在航空电子产品组装过程中,片式贴装元器件在回流焊后出现较多锡珠的问题影响了焊膏喷印工艺的推广应用,经过工艺分析和DOE试验,在不降低锡量,甚至增加锡量的情况下,将锡珠产生率降低85%,满足IPC-A-610的3级高性能电子产品要求。

Solder paste jet printing technology is a kind of non-contact spraying method without stencil.It directly sprays the solder onto the pad corresponding to PCB according to the set parameters.The position and volume of solder paste jet printing can be flexibly programmed and controlled,suitable for multi-variety and small batch production.In the assembly process of avionics products,there are more solder ball around surface mount components after reflow,which seriously affects the popularization and application of jet printing.Through DOE experiment and process analysis reduce 85%solder ball without reducing even increasing the amount of solder paste.And meet IPC-A-610 three class products requirements.