微型热电制冷器中半导体热电元件热电冷却过程的建模与仿真研究

Research on modeling and simulation of the thermoelectric cooling process of semiconductor thermoelectric element in mini thermoelectric cooler

全球精密的航空航天设备、家用电器设备等微电子热管理系统控制元件的有效散热都体现了微型热电制冷器(Thermoelectric Cooler,TEC)的重要作用。基于有限元多物理场仿真软件对TEC的热电冷却过程及半导体热电元件工作过程中的Peltier效应进行模拟仿真。研究表明:TEC的电功率与电流呈正比关系,两端的陶瓷基板温度受电流的影响,且工作电流为3.2~3.4 A(工作电流范围为0.4~3.6 A)时有最大温差;电流在Bi_(2)Te_(3)半导体热电元件循环时会出现Peltier冷却效应,半导体元件的连接点(P-N结)处会产生50 V的电压,最低温度为60.9 K。该研究内容对微型热电制冷器及其热电元件在电子器件热管理中的应用、设计和优化具有较高的参考价值和指导意义。

The effective heat dissipation of the global precision aerospace equipment,household appliances and other microelectronic thermal management system control components reflects the important role of thermo electric cooler.Based on the finite element multiphysics simulation software,the thermoelectric cooling process of TEC and the Peltier effect in the working process of semiconductor thermoelectric elements is simulated,research shows:The electrical power of the TEC is proportional to the current;The working temperature of TEC is affected by the current intensity,when the working current is 3.2~3.4 A(working current range is 0.4~3.6 A),there is a maximum temperature difference;The Peltier cooling effect will appear when the current circulates in the Bi_(2)Te_(3)semiconductor thermoelectric element;A voltage of 50 V is generated at the connection point(P-N junction)of the semiconductor element,and the minimum temperature is 60.9 K.The research content has high reference value and guiding significance for the application,design and optimization of micro-thermoelectric coolers and their thermoelectric elements in the thermal management of electronic devices.