摘要
介绍了活性氧化铜的主要用途、市场需求,叙述了曾经使用过的该产品活性的主要测试方法及我国新近颁布的该产品行业标准中给出的规范、统一的活性测试方法,评述了直接沉淀法、低温氧化湿法分解法、溶铜-脱氨法、络合沉淀法等活性氧化铜目前主要制取方法的工艺过程、技术特点和产品质量等研究现状,分析了各制取方法的主要优点及尚存在的主要不足。认为活性氧化铜及其制取方法的发展趋势是,对现有溶铜-蒸氨法工艺进行深入研究,提出有效的改进措施,进一步提升产品的活性、流动性等品质,改善其应用性能等。
The main application and market demand of active copper oxide were introduced. The main test methods used for the activity of the product and the standardized and unified test methods for the activity given in the newly promulgated industrial standard of the product in China were described. The research status of the process, technical characteristics and product quality of the main preparation methods of active copper oxide, such as direct precipitation method, low temperature oxidation wet decomposition method, copper dissolution-denitrification method and complex precipitation method, were reviewed. The main advantages and disadvantages of each preparation method were analyzed. It is believed that the development trend of active copper oxide and its preparation method is to conduct in-depth research on the existing copper dissolution-ammonia distillation process, and put forward effective improvement measures to further improve the quality of products such as activity and fluidity, and improve their application performance.
作者
吕照辉
李嘉琪
杨孙梅
刘后传
于少明
LÜZhaohui;LI Jiaqi;YANG Sunmei;LIU Houchuan;YU Shaoming(Taixing Smelter Co.,Ltd.,Taixing,Jiangsu 225400;School of Chemistry and Chemical Engineering,Hefei University of Technology,Hefei 230009;Hefei Mingmei New Materials Research Institute Co.,Ltd.,Hefei 230088.)
出处
《化工生产与技术》
CAS
2022年第3期31-34,I0004,共5页
Chemical Production and Technology
基金
合肥工业大学科技合作项目(W2020JSKF0085)。
关键词
活性氧化铜
制备
印制电路板
镀铜
active copper oxide
preparation
printed circuit board
copper plating