微波毫米波T/R组件内键合引线熔断机理研究

Study on Fusion Mechanism of Bonding Wires in Microwave and Millimeter Wave T/R Module

键合引线的耐电流水平是影响键合可靠性的重要因素之一,直接决定了雷达微波毫米波T/R组件的使用寿命。文中结合雷达微波组件的实际应用需求,开展键合引线耐电流水平研究,并深入分析了引线熔断机理,探讨引线熔断的微观过程,为电讯设计提供数据和理论参考。研究发现,键合引线熔断过程是焦耳热作用下的原子热迁移过程。熔断电流水平受外部气氛影响,大气气氛下的熔断电流水平略高于真空气氛下,可为航天产品设计提供参考。

The current withstanding capability of bonding wires is one of the key factors affecting the wire bonding reliability, which directly determines the functioning life of microwave and millimeter wave T/R modules. In this paper, the current withstanding capability of bonding wires is studied according to the practical application requirements, the mechanism and the microscopic process of the fusion of bonding wires are investigated too, which provide the data and theoretical references for the electrical design. The study reveals that the fusion process is the process of thermal migration of metal atoms. The fusion current is related to the external atmosphere environment. The fusion current under atmosphere is slightly higher than that under vacuum environment. This result provides a reference for the design of aerospace products.