变频空调主板散热器仿真方法与实验研究

Simulation Method and Experimental Research on The Heat Sink of Inverter Air Conditioner

通过ANSYS Fluent软件,使用两种仿真方法,分别对某型分体式空调室外机主板芯片冷却散热器进行数值模拟,并通过实验验证了仿真的准确性。以case-1散热器,仿真模型1为基准。校核元器件热功耗后,分别使用仿真1与仿真2对case-1散热器、case-2散热器进行计算,对比试验结果,仿真1中元器件温度最大温差为2.7 ℃,最大误差为9.74 %;仿真2中元器件温度变化值最大温差为1.47 ℃;最大误差为26.35 %。实验与仿真结果表明,仿真1计算量小,但精度较低,适合粗略计算;仿真2计算量大,但精度高,适合对比优化分析。仿真值与实验值吻合良好,说明了仿真结果的准确性,对今后空调主板散热器的数值仿真计算具有一定的指导意义。

Using ANSYS Fluent software,two simulation methods were used to numerically simulate the cooling heat sink of the motherboard chip of the split air conditioner outdoor unit,and the accuracy of the simulation was verified through experiments.Take case-1 heat sink and simulation 1 as the benchmark.After checking the thermal power consumption of the components,use simulation 1 and simulation 2 to calculate the case-1 heat sink and case-2 heat sink,and compare the test results.The maximum temperature difference of the component temperature in simulation 1 is 2.7 ℃,and the maximum error is 9.74 %;the maximum temperature difference of the component temperature change value in simulation 2 is 1.47 ℃;the maximum error is 26.35 %.The experimental and simulation results show that simulation 1 has a small amount of calculation,but the accuracy is low,and is suitable for rough calculation;simulation 2 has a large amount of calculation but high accuracy,and is suitable for comparative optimization analysis.The simulation value is in good agreement with the experimental value,which shows the accuracy of the simulation result and has certain guiding significance for the numerical simulation calculation of the heat sink of the air conditioner motherboard in the future.