靶材对铜爆炸箔电爆炸性能一致性的影响

Effect of target on consistency of electrical explosion performance of copper explosive foil

本研究选择3种典型纯度99.9%、99.99%、99.999%铜靶材模拟批次性差异,用相同磁控溅射工艺制备薄膜。用X射线衍射、场发射扫描电子显微镜、霍尔测试系统测试表征,分析不同溅射靶材对薄膜的微观结构和电阻率的影响。通过微加工光刻技术将上述铜薄膜制备成桥箔,用电爆炸测试系统研究了铜爆炸箔电爆炸性能。测试结果表明:在高电压2.1 kV时,99.999%Cu桥箔爆发时刻为257 ns,峰值电压为1473 V,峰值功率为1640400 W;而纯度为99.9%铜桥箔,相比于前者其爆发时刻延迟了12.45%,峰值电压降低了12.22%,峰值功率降低12.29%。说明在实际工程应用中,靶材纯度不同会影响电爆炸参数的一致性。

Three copper targets typical purity of 99.9%,99.99%and 99.999%were selected to simulate the difference in batch properties,and the corresponding films were prepared with the same magnetron sputtering process.The influence of different sputtering target material on the microstructure and resistivity of the films were analyzed by X-ray diffraction(XRD),field emission scanning electron microscopy(SEM)and Hall test system.The above three copper films were prepared into bridge foil by micro-processing photoresist technology and the electro-explosion performance of copper explosion foil was studied by the electro-explosion test system.The test results show that at high voltage 2.1 kV,99.999%Cu bridge foil burst time is 257 ns,peak voltage is 1473 V and peak power is 1640400 W;Compared with the former its burst time delay of 12.45%,the peak voltage of the purity of 99.9%copper bridge foil decreased by 12.22%and the peak power reduced by 12.29%.The results show the change of target purity will affect the consistency of electric explosion parameters in practical engineering applications.