一种MEMS平面线圈电镀方法

An electroplating method for MEMS planar coil

电镀是微机电系统(micro-electro-mechanical system, MEMS)中制备平面线圈结构的常用工艺,电镀工艺中的边缘效应引起平面线圈表面电流密度分布不均匀,影响平面线圈电镀质量。利用有限元仿真软件,计算电镀平面线圈工艺电流及其密度,寻求最佳工艺参数。利用增加陪镀结构的方法,有效抑制平面线圈电镀工艺中的边缘效应,进一步优化电流密度分布。在此基础上开展电镀工艺,使用30℃的硫酸盐溶液制备了结构完整、表面光滑的双层平面线圈。测试结果表明:带有陪镀结构的双层平面线圈宽度误差0.1μm,厚度误差0.6μm,对电镀平面线圈具有广泛的实用意义。

Electroplating is a common process for fabricating planar coil structure in micro-electro-mechanical system(MEMS).The edge effect in the electroplating process causes uneven distribution of current density on the surface of the planar coil and affects the electroplating quality of the planar coil.The finite element simulation software was used to calculate the process current and density of the electroplating plane coil, and seek the best process parameters.The edge effect in the plating process of planar coil was effectively suppressed by adding the accompanying structure, and the current density distribution was further optimized.On this basis, the electroplating process was carried out, and the double-layer planar coil with a complete structure and smooth surface was prepared by using a 30 ℃ sulfate solution.The test results show that the width error of the double-layer planar coil with accompanying plating structure is 0.1 μm, and the thickness error is 0.6 μm, which has extensive practical significance for electroplating planar coil.