红外焦平面探测器键合和剪切可靠性试验研究

Study on bonding and shear reliability test of infrared focal plane detector

红外焦平面探测器可靠性与生产研制工艺过程控制要求密切相关。本文对探测器的可靠性考核思路进行了分析,结合目前标准中可靠性试验存在的问题,对芯片和杜瓦组装过程中的引线键合强度、芯片剪切强度开展了试验研究,为指导红外焦平面探测器的研制生产、全面评价其质量和可靠性提供依据,为后续红外焦平面探测器的标准制修订工作奠定基础。

The reliability of infrared focal plane array detectors is is intimately connected with the manufacturing process control requirements.In this paper,the idea of reliability assessment of detector is analyzed.Referring to the problems of reliability tests in current standards,during chip and Dewar assembly,die shear strength and wire bonding strength tests were studied.The research results provide the basis for guiding the development and production of infrared focal plane array detectors,evaluating their quality and reliability,and laying the foundation of the standard preparation for the infrared(IR)detectors field.