硅铝合金壳体焊接连接器气密性分析

Air Tightness Analysis of Silicon-Aluminum Alloy Shell Welded Connectors

介绍了一种硅铝合金微波封装壳体。该硅铝合金壳体采用局部导电氧化、局部镀金工艺,将射频同轴连接器和低频矩形连接器分别焊接到壳体上,经过多次温度循环试验,铝合金壳体焊缝出现明显裂纹,硅铝合金壳体焊缝完好。与铝合金壳体相比,硅铝合金壳体的热膨胀系数更低,与采用可伐合金外壳的低频矩形连接器和射频同轴连接器的热膨胀系数匹配更好,因此气密性能表现更好,长期存储可靠性更高。

The silicon-aluminum alloy microwave component shell is introduced.The processing technology of local conductive oxidation and local gold plating is adopted in the silicon-aluminum alloy shell.The radio frequency(RF)coaxial connector and low frequency(LF)rectangular connector are welded to shells respectively.Compared with the aluminum alloy shell,the welds of silicon-aluminum alloy shell are intact after several temperature cycle tests.The silicon-aluminum alloy shell has lower thermal expansion coefficient,which better matches the thermal expansion coefficient of the kovar alloy shell of LF rectangular connector and RF coaxial connector.The silicon-aluminum shell has better air tightness performance and higher long-term storage reliability.