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改性Ca_(0.7)La_(0.2)TiO_(3)陶瓷增强乙烯基含硅芳炔树脂复合材料的界面与性能

Properties and the Interface of Modified Ca_(0.7)La_(0.2)TiO_(3) Ceramics Reinforced Vinyl Silicon-containing Aryne Resin Composites
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摘要 采用30%H_(2)O_(2)和乙烯基三甲氧基硅烷(VTMS)对Ca_(0.7)La_(0.2)TiO_(3)(CLT)进行了羟基化(CLT-OH)和硅烷化(CLT-VT)改性,分别在陶瓷表面获得了亲水和疏水层,两者分别与树脂间形成氢键作用和物理吸附。采用熔融浇铸法,将改性后的陶瓷和乙烯基含硅芳炔树脂树脂(PSAE)制备成具有系列化介电常数微波介质复合材料,研究了不同陶瓷/树脂界面作用力对复合材料性能的影响。结果表明,40vol%CLT-VT/PSAE获得了10 GHz下最优的介电性能,介电常数13.8,介电损耗3.16×10^(-3);40vol%CLT-OH/PSAE获得了最优的综合性能,弯曲强度达50 MPa,介电常数14.77,介电损耗3.29×10^(-3)。 Ca_(0.7)La_(0.2)TiO_(3)(CLT) was respectively hydroxylated(CLT-OH)by 30% H_(2)O_(2) and modified(CLT-VT)by Trimethoxy(vinyl)silane(VTMS).The hydrophilic and hydrophobic layers are respectively obtained on the ceramic surface,and they form hydrogen bonding and physical adsorption with the resin.By melt casting method,the modified ceramics and vinyl silicon-containing aryne resins(PSAE)were prepared into a series of microwave dielectric composite materials with different dielectric constants.The effect of different ceramic/resin interface forces on the properties of composite materials was studied.It was found that 40 vol%CLT-VT/PSAE achieved the best dielectric performance at 10 GHz,with a dielectric constant of 13.8 and a dielectric loss of 3.16×10^(-3) and 40 vol%CLT-OH/PSAE has obtained the best overall performance,with a bending strength of 50 MPa,a dielectric constant of 14.77,and a dielectric loss of 3.29×10^(-3).
作者 缪金波 彭海益 黄燕春 姚晓刚 邓诗峰 MIAO Jinbo;PENG Haiyi;HUANG Yanchun;YAO Xiaogang;DENG Shifeng(Key Laboratory of Special Functional Polymeric Materials and Related Technology,School of Material Science and Engineering,East China University of Science and Technology,Shanghai 200237;Information Materials and Devices Research Center,Shanghai Institute of Ceramics,Chinese Academy of Science,Shanghai 200050)
出处 《宇航材料工艺》 CAS CSCD 北大核心 2022年第3期30-36,共7页 Aerospace Materials & Technology
基金 装备发展部重点基金(61409220301) 中央高校基本科研业务费专项资金资助(50321042017001)。
关键词 氢键 物理吸附 微波介质复合材料 力学性能 介电性能 Hydrogen bonding Physical adsorption Microwave Dielectric composites Mechanical properties Dielectric properties
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  • 1周围,张健,尹国光,黄发荣.氯化含硅芳炔树脂的合成[J].石油化工,2007,36(6):618-622. 被引量:14
  • 2Itoh M, Inoue K, Iwata K, et al. New Highly Heat-resistant Polymers Containing Silicon[J]. Macromolecules, 1997,30(4): 694-701.
  • 3Buvat P, Jousse F, Delnaud L, et al. Synthesis and Properties of New Processible Type Polyarylacetylenes[A]. Repecka L, Saremi F F. International SAMPE Symposium and Exhibition[C]. California: Society for the Advancement of Materials and Process Engineering, 2001,46: 134-144.
  • 4Ishikawa M, Hatano T, Hasegawa Y, et al. Polymeric Organosilicon Systems: 12. Synthesis and Anionic Ring-opening Polymerization of 1,2,5,6- Tetrsilacyclooeta- 3, 7 - Diynes[J]. Organometallics, 1992, 11(4): 1604-618.
  • 5Kuroki S, Okita K, Kakigano T, et al. Thermosetting Mechanism Study of Poly[(phenylsilylene)ethynylene-I ,3-phenyl(eneethynylene)] by Solid-state NMR Spectroscopy and Computational Chemistry[J]. Macromolecules, 1998,31(9): 2804-2808.
  • 6Brefort J L, Corriu R J P, Gerbier P, et al. New Poly[(silylene)diacetylenes] and Poly[(germylene)diacetylenes]: Synthesis and Conductive Properties[J]. Organometallics, 1992, II (7): 2500-2506.
  • 7Corriu R J P, Gerbier P, Guerin C, et al. Organosilicon Polymers: Pyrolysis Chemistry of Poly[(dimethysilylene)diacetylene][J]. Organometallics, 1992, 11(7): 2507-2513.
  • 8Itoh M, Mitsuzuka M, Iwata K, et al. A Novel Synthesis and Extremely High Thermal Stability of Poly[(phenylsilyI ene)ethynylene-I,3-phenyleneethynylene] [J]. Macromolecules, 1994,27(26): 7917-7919.
  • 9Itoh M. Poly(silylene-ethynylene-phenylene-ethynylenes) and Their Manufacture and Thermally Hardened Products[P]. Eur. Pat.: 617073,1994-09-28.
  • 10Itoh M. A Novel Synthesis of a Highly Heat-resistant Organosilicon Polymer Using Base Catalysts[J]. Catalysis Surveys from Japan, 1999,3(1): 61-69.

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