SMA连接器专用旋转式深度可控的多点打铆技术研究

Research on Rotary and Depth Controlled for Multi-Points Fasten of SMA Connectors

在电子装备领域的天线产品上,SMA连接器的使用非常普遍,在其使用过程必须保证介质层与外导体和中心内导体的位置对应关系,因此装配过程中,外导体与介质之间需要进行加压铆接,而目前已有的铆接方式点位偏差大,敲击力量由操作者根据经验控制,铆接深度一致性差,且装配效率极低。基于已设计并应用的SMA连接器专用旋转式深度可控的多点打铆工装,该文主要从铆接过程分析,改进目标提出,改进方案设计,实物改进试验及改进效果对比这几个方面进行全过程介绍。

In antenna products in the field of electronic equipment,SMA connectors were used common.When used them,the dielectric layer must be fixed with the external conductor and the internal conductor.So during the assembly process,we should fast the external conductor and the dielectric layer.The deviation of existing riveting point is large,the consistency is poor,and the assembly efficiency is low.Based on the designed and applied equipment,this paper mainly introduces the whole process from the aspects of process analysis,improvement objectives,scheme design,and physical improvement test.Then we compare the effects about the improvement.