S-C波段大功率瓦片式T/R组件的设计与实现

Design and Implementation of S-C Band High-power Tile T/R Module

介绍一种可应用于相控阵系统的宽带大功率瓦片式T/R组件的设计,采用两层高密度电路基板(LTCC)三维层叠的方式,可显著减小组件的尺寸。采用集成液冷流道的一体化盒体,解决瓦片式T/R组件高效散热的难题。设计并加工了4通道瓦片式T/R组件。组件实测结果证明该瓦片式的方案能够很好地应用于平面阵、共形阵等大功率相控阵系统。

The design of a wideband high-power tile T/R module with compact package for phased array system applications is presented.The proposed two-layer tile package based on LTCC contributes to a dramatic reduction in size of the T/R module.In order to solve the problem of heat dissipation of the tile T/R module,liquid cooling channel has been integrated in the structure.The tile T/R module with four channels is designed and processed.The measured results of components show that the proposed tile structure can be well suited for high-power planar phased array and conformal phased array application.