高频电路防护的氟碳化合物等离子气相沉积技术

Fluorocarbon PECVD for High Frequency Circuit Conformal Protection

电子装备小型化、阵列化的发展趋势,引领着印制电路组件的工作频段向着微波、毫米波频段扩展。敷形涂层作为印制电路抵御环境腐蚀能力的重要组成部分,其适用频段也亟需提高。基于此,开展了氟碳化合物作为高频电路敷形防护涂料的应用研究,通过理论分析、样件试验的手段,验证了氟碳化合物通过等离子气相沉积可在高频电路表面形成均匀致密且不影响其电气性能的防护涂层。同时,通过与有机硅、派瑞林等传统高频涂料的性能进行对比,进一步证明,氟碳化合物等离子气相沉积,是高频电路敷形防护的一种有效手段。

With the development of miniaturization and array about electronic equipment,the working frequency band of printed circuit assemblies expand to microwave and millimetre wave.As an important part of the resistance to environmental corrosion,the frequency band of conformal coating needs to be improved.Therefore,the research on the application of fluorocarbon in the field of high frequency circuit conformal coating has been carried out.Through theoretical analysis and sample testing,the fluorocarbon by plasma enhanced chemical vapour deposition(PECVD)has been verified that the uniform and compact protective coating can be formed on the surface of high frequency circuit without affecting electrical properties.Compared with traditional high frequency coatings such as silicone and parylene,it has been further proved that fluorocarbon by PECVD is an effective method of high frequency circuit conformal protection.