大尺寸陶瓷柱栅阵列器件的加固工艺

Reinforcement Process of Column Ceramic Gray Array Devices with Large Size

陶瓷柱栅阵列(Column Ceramic Gray Array,CCGA)封装器件具有电热性能良好以及高密度互联的特点,在航天型号任务中应用广泛。现这类器件的应用最大尺寸为35 mm×35 mm,而更大尺寸CCGA封装器件应用报道还不多。尺寸增加,器件质量进一步增加,力学性能变差,对其加固工艺提出更高要求。以45 mm×45 mm尺寸CCGA器件为研究对象,对其加固工艺进行了研究。设计了带菊花链导电通路的电路板,通过热循环及随机振动试验,对两种工艺进行了对比。结果表明,仅四角采用环氧胶加固,Z向随机振动后,某些通道电阻值显著增加,焊点有贯穿性裂纹。采用四角环氧胶粘+灌封硅橡胶的加固方式,试验后通道电阻值未发生变化,焊点虽有裂纹,但未贯穿,抗振性能提升显著。

Column ceramic gray array packaging devices are wildly used in space program for its favorable electric-thermal property and high density interconnection.At present,the maximum size of such devices is 35 mm×35 mm,but there are few reports on the application of larger size CCGA package devices.Mechanical properties become worse with increasing the devices size and mass,more attention should be paid for the mechanical strengthening process.Hence,CCGA with 45 mm×45 mm is studied for its mechanical strengthening process.A test PCB with daisy-chain is designed,through thermal cycle and random vibration tests,two strengthening processes are compared.The results show that for strengthened process using epoxy glue at the four corners,the resistance improves obviously after random vibration for Z direction and penetrating crack can be find on the solder joint.However,for the strengthened process using epoxy glue at the four corners and embedment with silicone rubber,the resistance has no change after all tests.There is also crack on the solder joint but not penetrated,and the anti vibration performance is significantly improved.