混合集成电路基板全自动装载技术

Automatic Loading Technology of HIC Board

随着信息化产业的快速发展,混合集成电路的生产与制造向着数字化、信息化、智能化的方向迈进,制造技术也逐步由手工和半自动化生产向自动化、数字化方向转变。在此发展需求下,阐述了一套由机器人取代人工完成混合集成电路焊接过程中的物料上料、助焊剂喷涂、焊片及基板装载的自动化作业系统,包括该系统的设计目标、系统原理、关键技术及应用验证。

With the rapid development of national information industry,the production of hybrid integrated circuits are also moving forward to digitalization,informatization and intelligentialize,and the manufacturing technology is gradually changing from manual and semi-automatic production to automation and digitalization.Based on the development demand,a set of automatic system for material loading,flux spraying,solder chip assembly and substrate assembly is described,which load in the hybrid IC soldering process and use robot instead of manual,including the design goal,system principle,key technology and application verification.