叠层封装元器件在航天领域中的应用

Application of Laminated Packaging Components in Aerospace Field

分析表明,在航天领域,为适应单机产品小型化的要求,叠层封装的存储器已经得到了广泛应用。阐述PoP结构的元器件具有集成度高、小型化、轻量化的优点,在航天领域对产品的可靠性的更高要求,探讨PoP结构元器件,分析它的热负载和振动可靠性,提出有针对性的可靠性试验项目。

The analysis shows that in the aerospace field, in order to meet the requirements of single machine product miniaturization, laminated memory has been widely used. This paper expounds that the components of pop structure have the advantages of high integration, miniaturization and lightweight, and have higher requirements for the reliability of products in the aerospace field. This paper discusses the components of pop structure, analyzes its thermal load and vibration reliability, and puts forward targeted reliability test items.