超多孔印制板的高速钻孔加工技术研究

Research on high-speed drilling technology of PCB with super much holes

当前印制板上的导通孔数量激增,对钻孔效率提出了更高的要求。印制板孔的主要加工方式是机械钻孔和激光钻孔。文章对硬板材料采用机械钻孔的方式,基于供应商资料调整钻孔加工参数,逐步逼近钻孔品质极限,取得了较大幅度的钻孔效率提升和小幅度的钻刀寿命提升。对挠性板材料则采用激光钻孔方式进行通孔加工,并匹配等离子体除碳化方案,实现了激光通孔的高速无碳化加工,极大提升了软板的孔加工效率。

The through hole is an important part of the Printed Circuit Board(PCB). The through hole is formed in two ways: mechanical drilling and laser drilling. This article compares the company’s processing parameters with Rogers’ recommended processing parameters, and improves the quality and efficiency of mechanical drilling and reduces costs through experiments. For the flex plate material, the laser drilling method is used for through-hole processing, and the plasma carbonization scheme is matched to realize the high-speed non carbonization processing of the laser through-hole, which greatly improves the holes processing efficiency of the flex substrate.