一种高速印制电路板孔壁分离的原因分析及改善

Cause analysis and improvement for a special hole wall pull away defect of high speed PCB

5G时代的来临,推动着高频高速覆铜板材料及高多层印制电路板的飞速发展,新材料、新加工技术也层出不穷,但这也带来了新的挑战和新的失效模式。文章主要针对一种孔壁分离现象,其缺陷特征及产生原因与过去常见的孔壁分离有所不同,我们从机理出发进行探究并提出相应的改善措施。

The advent of the 5G has promoted the rapid development of high-frequency and high-speed Copper Clad Laminate materials and high-layer Printed Circuit Boards.New materials and new processing technologies are also emerging in endlessly,but this also brings new challenges and new failure modes.This article mainly focuses on a phenomenon of hole wall pull away,which defect characteristics and causes are different from the common hole wall pull away in the past.And the author explores the mechanism and proposes corresponding improvement measures.