等离子体处理在改进型半加成工艺中的应用

Application of plasma treatment in modified Semi-Additive Process

等离子体处理在印制电路板加工应用非常广泛,在使用改进型半加成工艺(mSAP)制作线宽/线距≤45μm/45μm的高精密线路时,等离子体处理在提升线路加工良率的方面有着至关重要的作用。文章研究表明使用改进型半加成工艺制作高精密线路时在电镀加成前增加等离子体处理,可以有效改善线路图形,提升制作高精密线路的良率。

Plasma processing is widely used in Printed Circuit Board processing.Plasma treatment plays a key role in improving line machining yield when making high precision lines with line width≤45μm/45μm using modified Semi-Additive Process(mSAP).The research of this paper can clearly show that adding plasma treatment before electroplating addition can effectively improve the abnormal anti-electroplating problem during electroplating addition of high-precision lines and improve the yield of high-precision lines by using mSAP.