印制板用电解铜箔时效研究

Study on storage time of electrolytic copper foil for PCB

电解铜箔是PCB所用的重要基础原材料。文章研究了PCB用铜箔存储时效,如HTE、RTF、HVLP铜箔,将铜箔分别放置1个月、2个月、3个月、6个月,然后测试铜箔放置不同时间的外观、粗糙度、表面形貌、FTIR、抗剥强度、耐热性等性能。结果表明,不同铜箔的时效存在差异,HTE和RTF铜箔放置6个月后,其各项性能无明显变化,而HVLP铜箔放置1个月后,其耐热性明显下降,FTIR观察发现铜箔表面耦联剂层的特征峰发生变化。铜箔时效的研究,可以给生产对于铜箔的使用和管理提供参考。

Electrolytic copper foil is an important basic raw material used in PCB.This article studies the storage time of copper foil for PCB,such as HTE,RTF,HVLP copper foil,and places the copper foil for 1 month,2 months,3 months,and 6 months,and then respectively tests the appearance,roughness,surface morphology,FTIR,peel strength,heat resistance of the copper foil at different times.The results show that there are differences in the storage time of different copper foils.The properties of HTE and RTF copper foils have not been changed significantly after being placed for 6 months,while the heat resistance of HVLP copper foils has been significantly reduced after being placed for 1 month.FTIR observation reveals that the characteristic peaks of the coupling agent layer on the copper foil surface have been changed.The research can provide a reference for the use and management of copper foil in production.