一种超低损耗材料层间分离的改善探讨

Discussion on the improvement of interlayer separation of an ultra-low loss material

随着高端通信设备高密度、高速及信号超低损耗的发展,材料生产商陆续推出超低损耗的高速类板材,文章将围绕一种超低损耗新材料在PCB加工过程中出现的层间分离,重点分析了钻孔参数如进刀速、转速以及寿命等的影响,另外对比验证了等离子加工参数对孔壁质量的影响,最终解决了ICD问题。

With the development of high density,high speed and ultra-low loss of high-end communication equipment,material manufacturers have successively introduced ultra-low loss high-speed material.This paper focused on the interlayer separation of a new material with ultra-low loss in PCB processing.The influence of drilling parameters such as feed speed,rotational speed and hole limit was analyzed,and the influence of plasma processing parameters on hole wall quality was compared and verified.Finally,the ICD problem was solved.